Product
NEMST-AS2002
Plasma Asher
- High treatment uniformity
- Be able to conduct 6 or 8 inches wafer
- Up to 25 ~ 50 wafers per load
- Cycle time about 20 ~ 25 min
- High Density Plasma System ( ICP)
- Damage Free Design
- Electrodes with Water-cooling Mechanism
- Widely utilized in the semiconductor and LED industries, this system provides highly efficient removal of various photoresists and offers precision processing for advanced packaging technologies, including FOPLP and FOWLP.