Product

NEMST-2002ILseries

In-line Plasma Cleaner (Fully In-line)

In-line Plasma Cleaner (Fully In-line)
In-line Plasma Cleaner (Fully In-line)
  • Full In-line Plasma, Connecting to Upstream and Downstream Tools.
  • Advanced Flow Pattern Design.
  • High-Speed Plasma Cleaning: 28~33 seconds/cycle in general, including loading, plasma treatment, and unloading.
  • Low-Temperature Plasma Cleaning.
  • Chamber Capability: 1~2 strips of subWholestrates or lead-frames in one cycle. Operation Mode: Manual or Auto Mode.
  • High Automation and Operation Friendly Design.
  • Connecting with upstream and downstream tools. Multiple Processing Gases (Ar, O2, H2, mixed gas, etc.) can achieve the best surface cleaning and treatment effects. Physical, Chemical, or Physical/Chemical Mode Cleaning Method. Extremely High Cleaning Uniformity. Very Little Gas Consumption.
  • Target Applications: Ideal for LED Packaging, IC Packaging (substrate cleaning prior to Die Bonding, Wire Bonding, or Molding), CPO, SMT, and other high-tech sectors.
  • Core Functionality: Specifically designed for surface cleaning and modification prior to various SMT (Surface Mount Technology) processes.
  • Product Versatility: Supports a wide range of products including Flip-Chip, BGA, and Lead Frame variants (e.g., PBGA, TFBGA, Window-BGA, Mini-BGA, Micro-BGA, LFBGA, VBGA, Pin BGA, TCP, PCB, COB, MMC, SD, Micro-SD, QFN/MLP, and Cu/Ag Lead Frames).