NEMS Participates in IMAPS Symposium 2026 | Sharing Our Latest Plasma Technology

NEMS will participate inIMAPS Symposium 2026, taking place in Boston, Massachusetts, from September 28 to October 1, 2026. This year’s symposium is themed “Intelligent Packaging for the AI Era: Heterogeneous Integration and Photonics,” focusing on advanced packaging and heterogeneous integration technologies for the AI era.

Following our first technical presentation at IMAPS Symposium in San Diego last year, NEMS will return to the technical program this year to share our latest research:

Breaking the Oxide Barrier: Cost-Efficient Plasma De-oxidation of Copper Surfaces for Advanced Hybrid Bonding

The study focuses on copper surface treatment for Cu-Cu Hybrid Bonding, exploring the application of H₂/N₂ Atmospheric-Pressure DBD Plasma for copper surface de-oxidation.

In addition, NEMS will participate in the IMAPS Exhibition for the first time this year. We welcome you to visit us at Booth #211 and exchange ideas on the latest plasma technologies and advanced packaging applications.

IMAPS Symposium 2026
📅 September 28 – October 1, 2026
📍 Encore Boston Harbor, Boston, Massachusetts
🏢 Exhibition: September 29–30
📍 NEMS Booth #211