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產品介紹

  • 特色/設計說明
  • 性能特點
  • 應用/解決方案
  • 採用專利高密度感應耦合式電漿(ICP)電極設計,蝕刻速率快。                                                      
  • 即時張力控制。                                                                                                          
  • 收放捲在同一側,方便作業,也縮短上下料時間。                                                    
  • 配備雷射對標儀,可標齊收捲及放捲路徑,加快更換材料時間。                          
  • 配備切料台,增加便利性並加快更換材料的時間。                                                    
  • 配備OPG糾偏器(EPC)。                                                                                              
  • 每片電極獨立冷卻水循環,減少溫度梯度,增加蝕刻均勻度。                                 
  • 配備溫度控制器以控制電極溫度,維持製程穩定。                                                    
  • 配備製程溫度偵測器,可反饋並調控腔體溫度,確保製程穩定性。
  • 3~5 m/min 之高速電漿去膠渣處理,為業界同業機台之2~3倍速度。                                                       
  • 適用於260 mm film材之電漿處理。                                                                                  
  • 適用36 um以及更薄film材之電漿處理。                                                                           
  • ± 0.5 mm 之高精度收捲。                                                                                                 
  • 適用於各種不同張力材質。                                                                                                 
  • 適用於各式軟性電路板或膜材。                                                                                         
  • 操作簡易,上、下料便利性高。 
  • 軟性電路板(FPC)之孔內去膠渣/去殘膠/表面改質。                             
  • COF之孔內去膠渣/去殘膠/表面改質。                                                          
  • 任何film材之表面清潔、活化與改質。